# Vault 7: Projects

This publication series is about specific projects related to the Vault 7 main publication.

### Protego

# PIC24FJ64GA004

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PIC24FJ64GA004 FAMILY
DS39881E-page 18  2010-2013 Microchip Technology Inc.
2.2 Power Supply Pins
2.2.1 DECOUPLING CAPACITORS
The use of decoupling capacitors on every pair of
power supply pins, such as V
DD, VSS, AVDD and
AV
SS is required.
Consider the following criteria when using decoupling
capacitors:
 Value and type of capacitor: A 0.1 F (100 nF),
10-20V capacitor is recommended. The capacitor
should be a low-ESR device with a resonance
frequency in the range of 200 MHz and higher.
Ceramic capacitors are recommended.
 Placement on the printed circuit board: The
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is no greater
than 0.25 inch (6 mm).
 Handling high-frequency noise: If the board is
experiencing high-frequency noise (upward of
tens of MHz), add a second ceramic type capaci-
tor in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 F to 0.001 F. Place this
second capacitor next to each primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible
(e.g., 0.1 F in parallel with 0.001 F).
 Maximizing performance: On the board layout
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum, thereby reducing PCB trace
inductance.
2.2.2 TANK CAPACITORS
On boards with power traces running longer than six
inches in length, it is suggested to use a tank capacitor
for integrated circuits including microcontrollers to
supply a local power source. The value of the tank
capacitor should be determined based on the trace
resistance that connects the power supply source to
the device, and the maximum current drawn by the
device in the application. In other words, select the tank
capacitor so that it meets the acceptable voltage sag at
the device. Typical values range from 4.7 F to 47 F.
2.3 Master Clear (MCLR) Pin
The MCLR pin provides two specific device functions:
device Reset, and device programming and debug-
ging. If programming and debugging are not required
in the end application, a direct connection to V
DD may
be all that is required. The addition of other com-
ponents, to help increase the applications resistance
to spurious Resets from voltage sags, may be
beneficial. A typical configuration is shown in
Figure 2-1. Other circuit designs may be implemented,
depending on the applications requirements.
During programming and debugging, the resistance
and capacitance that can be added to the pin must
be considered. Device programmers and debuggers
drive the MCLR
pin. Consequently, specific voltage
levels (V
IH and VIL) and fast signal transitions must
not be adversely affected. Therefore, specific values
of R1 and C1 will need to be adjusted based on the
application and PCB requirements. For example, it is
recommended that the capacitor, C1, be isolated
from the MCLR
pin during programming and debug-
ging operations by using a jumper (Figure 2-2). The
jumper is replaced for normal run-time operations.
Any components associated with the MCLR
pin
should be placed within 0.25 inch (6 mm) of the pin.
FIGURE 2-2: EXAMPLE OF MCLR PIN
CONNECTIONS
Note 1: R1  10 k is recommended. A suggested
starting value is 10 k. Ensure that the MCLR
pin V
IH and VIL specifications are met.
2: R2  470 will limit any current flowing into
MCLR
from the external capacitor, C, in the
event of MCLR
pin breakdown, due to Electro-
static Discharge (ESD) or Electrical
Overstress (EOS). Ensure that the MCLR
pin
V
IH and VIL specifications are met.
C1
R2
R1
V
DD
MCLR
PIC24FXXXX
JP

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