# Vault 7: Projects

This publication series is about specific projects related to the Vault 7 main publication.

### Protego

# PIC24FJ64GA004

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 2010-2013 Microchip Technology Inc. DS39881E-page 233
PIC24FJ64GA004 FAMILY
TABLE 27-1: THERMAL OPERATING CONDITIONS
Rating Symbol Min Typ Max Unit
PIC24FJ64GA004 Family:
Operating Junction Temperature Range T
J -40  +140 °C
Operating Ambient Temperature Range T
A -40  +125 °C
Power Dissipation:
Internal Chip Power Dissipation:
PINT = VDD x (IDD –  IOH)
P
D PINT + PI/O W
I/O Pin Power Dissipation:
P
I/O =  ({VDD – V OH} x IOH) +  (V OL x IOL)
Maximum Allowed Power Dissipation P
DMAX (TJ  T A)/JA W
TABLE 27-2: THERMAL PACKAGING CHARACTERISTICS
Characteristic Symbol Typ Max Unit Notes
Package Thermal Resistance, 300 mil SOIC 
JA 49  °C/W (Note 1)
Package Thermal Resistance, 6x6x0.9 mm QFN 
JA 33.7  °C/W (Note 1)
Package Thermal Resistance, 8x8x1 mm QFN JA 28  °C/W (Note 1)
Package Thermal Resistance, 10x10x1 mm TQFP JA 39.3  °C/W (Note 1)
Note 1: Junction to ambient thermal resistance; Theta-
JA (JA) numbers are achieved by package simulations.

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